Load port module

ABSTRACT

A substrate loading device including a frame adapted to connect to a substrate processing apparatus, the frame having a transport opening through which substrates are transported to the processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container proximate the transport opening, the support configured so that a sealed internal atmosphere of the container is accessed from the support at predetermined access locations of the container, and the cassette support has a predetermined continuous steady state differential pressure plenum region, determined at least in part by boundaries of fluid flow generating differential pressure, so that the predetermined continuous steady state differential pressure plenum region defines a continuously steady state fluidic flow isolation barrier disposed on the support between the predetermined access locations of the container and another predetermined section of the support isolating the other predetermined section from the predetermined access locations.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of Ser. No. 16/692,359, filed Nov.22, 2019, (Now U.S. Pat. No. 10,923,375), which is a Non-provisionalapplication of and claims priority and benefit from U.S. Provisionalapplication No. 62/772,376, filed Nov. 28, 2018, the disclosures ofwhich are incorporated herein by reference in their entireties.

BACKGROUND 1. Field

The aspects of the present disclosure generally relate to substrateprocessing apparatus and, more particularly, to an improved load portmodule for the substrate processing apparatus.

2. Brief Description of Related Developments

In a semiconductor fabrication (also referred to as a “fab”)environment, during some semiconductor fabrication processes, load portsare subjected to corrosive gases (e.g., such as hydrogen bromide gas,hydrochloric acid gas, etc.) that may adversely affect exposedcomponents of the load ports. These exposed components of the load portsare typically coated with an anti-corrosion coating to mitigate theexposure to the corrosive gases.

Providing other corrosive gas mitigation has proven difficult andexpensive due to, for example, the unpredictable nature of gas flow(such as from purge vents of the load port or other gas sources) due to,for example: different geometries of the front opening unified pods(referred to as “FOUPS”) held by the load port; an amount of out-gassingof components within the FOUP may be different from FOUP to FOUP,numbers of wafers or substrates held by the FOUP may be different fromFOUP to FOUP, etc. Providing coatings on the load port components thatmay or may not be subjected to the corrosive gas increases cost of theload port. In addition, modifications of the load ports to accommodatethe coatings and/or to redirect the corrosive gas also increase cost,increase complexity of load port, and increase manufacturing lead timeof the load port.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the present disclosure areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1A is a schematic perspective view of a substrate processingapparatus in accordance with aspects of the present disclosure;

FIG. 1B is a schematic illustration of a substrate processing apparatusin accordance with aspects of the present disclosure;

FIG. 1C is a schematic illustration of a substrate processing apparatusin accordance with aspects of the present disclosure;

FIG. 2 is a schematic illustration of a load port module of any of thesubstrate processing apparatus of FIGS. 1A-1C in accordance with aspectsof the present disclosure;

FIG. 3 is a schematic illustration of the load port module of FIG. 2 inaccordance with aspects of the present disclosure;

FIGS. 4A-4D are schematic illustrations of a portion of the load portmodule of FIG. 2 in accordance with aspects of the present disclosure;

FIG. 5 is a schematic illustration of a portion of the load port moduleof FIG. 2 in accordance with aspects of the present disclosure;

FIGS. 6A and 6B are schematic illustrations of a substrate transportcontainer;

FIGS. 7A and 7B are schematic illustrations of a portion of thesubstrate processing apparatus of any of FIGS. 1A-1C in accordance withaspects of the present disclosure;

FIG. 8A is a flow diagram for coupling a container to a substrateprocessing apparatus in accordance with aspects of the presentdisclosure;

FIG. 8B is a flow diagram for decoupling a container to a substrateprocessing apparatus in accordance with aspects of the presentdisclosure;

FIG. 9 is a schematic illustration of a portion of the load port moduleof FIG. 2 in accordance with aspects of the present disclosure;

FIG. 10A is a schematic illustration of a portion of the load portmodule of FIG. 2 in accordance with aspects of the present disclosure;

FIG. 10B is a schematic illustration of a portion of the load portmodule of FIG. 2 in accordance with aspects of the present disclosure;

FIG. 11 is a schematic illustration of a portion of the load port moduleof FIG. 2 in accordance with aspects of the present disclosure;

FIG. 12 is a schematic illustration of a portion of the load port moduleof FIG. 2 in accordance with aspects of the present disclosure;

FIG. 13 is a schematic illustration of a portion of the load port moduleof FIG. 2 in accordance with aspects of the present disclosure;

FIG. 14 is an exemplary flow diagram in accordance with aspects of thepresent disclosure; and

FIG. 15 is an exemplary flow diagram in accordance with aspects of thepresent disclosure.

DETAILED DESCRIPTION

Referring to FIG. 1A, a perspective view of a substrate processingapparatus 10 incorporating features of the present disclosure isillustrated. Although the present disclosure will be described withreference to the aspects shown in the drawings, it should be understoodthat the present disclosure can be embodied in many alternate forms ofaspects. In addition, any suitable size, shape or type of elements ormaterials could be used.

In the aspect illustrated in FIG. 1A, the apparatus 10 has been shown,for example purposes only, as having a general substrate batchprocessing tool configuration. In alternate embodiments, the substrateprocessing apparatus may have any other suitable configuration, as thefeatures of the present invention, as will be described in greaterdetail below, are equally applicable to any substrate processing toolconfiguration including tools for individual substrate processing and/orlinear tool stations such as those illustrated in FIGS. 1B and 1C anddescribed in U.S. patent application Ser. No. 11/442,511, entitled“Linearly Distributed Semiconductor Workpiece Processing Tool,” filedMay 26, 2006, the disclosure of which is incorporated by referenceherein in its entirety. The apparatus 10 may be capable of handling andprocessing any desired type of flat panel or substrate such as 200 mm or300 mm semiconductor wafers, semiconductor packaging substrates (e.g.high density interconnects), semiconductor manufacturing process imagingplates (e.g. masks or reticles), and substrates for flat panel displays.The apparatus 10 may generally comprise a front section 12 and a rearsection 14. The front section 12 (the term front is used here forconvenience to identify an exemplary frame of reference, and inalternate embodiments the front of the apparatus may be established onany desired side of the apparatus). The front section 12 has a system(as will be described in greater detail below) providing an interfaceallowing the importation of substrates from the fab into the interior ofthe apparatus 10. The front section 12 also generally has a housing 16and automation components located in the housing handling substratesbetween the rear section 14 and the front section interface to theexterior. The rear section 14 is connected to the housing 16 of thefront section. The rear section 14 of the apparatus may have acontrolled atmosphere (e.g. vacuum, inert gas), and generally comprisesa processing system for processing substrates. For example, the rearsection may generally include a central transport chamber, withsubstrate transport device, and peripheral processing modules forperforming desired manufacturing processes to substrates within theapparatus (e.g. etching, material deposition, cleaning, baking,inspecting, etc.). Substrates may be transported, within the fab, to theprocessing apparatus 10 in containers T (also known as carriers). Thecontainers T may be positioned on or in proximity to the front sectioninterface. From the containers, the substrates may be brought throughthe interface, such as BOLTS (Box Opener/Loader to Tool Standard)interface, into the front section 12 using automation components in thefront section. The substrates may them be transported, via load locks,to the atmospherically controlled rear section for processing in one ormore of the processing modules. Processed substrates may then bereturned, in a substantially reversed manner, to the front section 12and then to the transport containers T for removal.

The front section 12, which may otherwise be referred to as anenvironmental front end module or EFEM, may have a shell or casingdefining a protected environment, or mini-environment where substratesmay be accessed and handled with minimum potential for contaminationbetween the transport containers T, used to transport the substrateswithin the FAB, and the load locks 14L providing entry to the controlledatmosphere in the rear processing section 14. Load ports or load portmodules 24 (one or more in number as will be described further below)are located on one or more of the sides of the front section providingthe interface between the front section and FAB. The load port modulesmay be substantially similar to those described in U.S. Pat. No.8,821,099 and entitled “Load Port Module”, issued on Sep. 2, 2014, thedisclosure of which is incorporated herein by reference in its entirety.The load port modules 24 may have closable ports 30P forming a closableinterface, such as the BOLTS interface, between the EFEM interior andexterior. As seen in FIG. 1A, the load port modules may have a supportarea for a substrate transport container T. A secondary holding area mayalso be provided under the support area, where transport containers maybe temporarily buffered. The transport container support area may allowautomated movement of the transport container T supported thereon to afinal or docked position. A port door, of the load port module, mayengage the transport container when in a docked position in order toopen the transport container while also opening the access port 30P inthe load port frame, to provide access to substrates within thetransport container as well as access for transporting the substratesbetween the container and EFEM interior. Engagement between the portdoor and transport container may be effected by independently operablekeys as described in U.S. Pat. No. 8,821,099. In accordance with theaspects of the present disclosure, the load port module(s) 24 describedherein include a differential pressure plenum space or region on oradjacent to a shuttle 52 of the load port 24. As will be describedherein, the differential pressure plenum substantially contains and/orevacuates any corrosive gases that may escape (e.g., gases that arevented) from the substrate transport container T, disposed on theshuttle and interfaced with the load port 24, through the container doorseal and/or substantially at the start (and/or substantially at the end)of purging/venting of the substrate transport container T by the loadport 24. The differential pressure plenum may also substantially containand/or evacuate corrosive gases that escape or are vented substantiallyat the opening of the substrate transport container T door by the loadport 24. The differential pressure plenum may substantially preventcorrosive gas contact with, for example, any suitable components of theload port 24 including, but not limited to, printed circuit boards(PCBs) 74 (FIG. 5), linear bearing(s) 283 (FIG. 3), motors (see e.g.,motor 53 (FIG. 4D), sensors (see sensors T12-T20 (FIG. 4B), sensor 68O(FIG. 5), switches 68 (FIG. 5), sensor 92 (FIG. 4C)), wire harness(es)72 (FIG. 4D), detection system(s) 110 (FIG. 2), and/or other suitablecomponents of the load port 24 that are in proximity of the container Tdisposed on the load port 24.

Referring now to FIG. 1B, a schematic plan view of a linear substrateprocessing system 2010 is shown where the tool interface section 2012 ismounted to a transfer chamber module 3018 so that the interface section2012 is facing generally towards (e.g. inwards) but is offset from thelongitudinal axis X of the transfer chamber 3018. The transfer chambermodule 3018 may be extended in any suitable direction by attaching othertransfer chamber modules 3018A, 3018I, 3018J to interfaces 2050, 2060,2070 as described in U.S. patent application Ser. No. 11/442,511,previously incorporated herein by reference. Each transfer chambermodule 3018, 3019A, 3018I, 3018J includes a substrate transport 2080 fortransporting substrates throughout the processing system 2010 and intoand out of, for example, processing modules PM. As may be realized, eachchamber module may be capable of holding an isolated, controlled orsealed atmosphere (e.g. N2, clean air, vacuum).

Referring to FIG. 1C, there is shown a schematic elevation view of anexemplary processing tool 410 such as may be taken along longitudinalaxis X of the linear transfer chamber 416. In one aspect, as shown inFIG. 1C, the tool interface section 12 may be representatively connectedto the transfer chamber 416. In this aspect, interface section 12 maydefine one end of the tool transfer chamber 416. As seen in FIG. 1C, thetransfer chamber 416 may have another workpiece entry/exit station 412for example at an opposite end from interface section 12. In otheraspects, other entry/exit stations for inserting/removing work piecesfrom the transfer chamber may be provided such as between the ends ofthe tool transfer chamber 416. In one aspect of the present disclosure,interface section 12 and entry/exit station 412 may allow loading andunloading of workpieces from the tool. In other aspects, workpieces maybe loaded into the tool from one end and removed from the other end. Inone aspect, the transfer chamber 416 may have one or more transferchamber module(s) 18B, 18 i. Each chamber module may be capable ofholding an isolated, controlled or sealed atmosphere (e.g. N2, cleanair, vacuum). As noted before, the configuration/arrangement of thetransfer chamber modules 18B, 18 i, load lock modules 56A, 56B andworkpiece stations forming the transfer chamber 416 shown in FIG. 1C ismerely exemplary, and in other aspects the transfer chamber may havemore or fewer modules disposed in any desired modular arrangement. Inone aspect station 412 may be a load lock. In other aspects, a load lockmodule may be located between the end entry/exit station (similar tostation 412) or the adjoining transfer chamber module (similar to module18 i) may be configured to operate as a load lock. As also noted before,transfer chamber modules 18B, 18 i have one or more correspondingtransport apparatus 26B, 26 i located therein. The transport apparatus26B, 26 i of the respective transfer chamber modules 18B, 18 i maycooperate to provide the linearly distributed workpiece transport system420 in the transfer chamber. In other aspects the transfer chambermodules 18B may be configured to allow any suitable transport cart (notshown) to travel between transfer chamber modules 18B along at least aportion of the length of the linear transfer chamber 416. As may berealized the transport cart 900 may include any suitable transportapparatus mounted thereto and substantially similar to those transportapparatuses described herein. As shown in FIG. 1C, in one aspect thearms of the transport apparatus 26B may be arranged to provide what maybe referred to as fast swap arrangement allowing the transport toquickly swap wafers from a pick/place location as will also be describedin further detail below. The transport arm 26B may have a suitable drivesection for providing each arm with three (3) (e.g. independent rotationabout shoulder and elbow joints with Z axis motion) degrees of freedomfrom a simplified drive system compared to conventional drive systems.In other aspects, the drive section may provide the arm with more orless than three degrees of freedom. As seen in FIG. 1C, in one aspectthe modules 56A, 56, 30 i may be located interstitially between transferchamber modules 18B, 18 i and may define suitable processing modules,load lock(s), buffer station(s), metrology station(s) or any otherdesired station(s). For example the interstitial modules, such as loadlocks 56A, 56 and workpiece station 30 i, may each have stationaryworkpiece supports/shelves 56S, 56S1, 56S2, 30S1, 30S2 that maycooperate with the transport arms to effect transport or workpiecesthrough the length of the transfer chamber along linear axis X of thetransfer chamber. By way of example, workpiece(s) may be loaded into thetransfer chamber 416 by interface section 12. The workpiece(s) may bepositioned on the support(s) of load lock module 56A with the transportarm 15 of the interface section. The workpiece(s), in load lock module56A, may be moved between load lock module 56A and load lock module 56by the transport arm 26B in module 18B, and in a similar and consecutivemanner between load lock 56 and workpiece station 30 i with arm 26 i (inmodule 18 i) and between station 30 i and station 412 with arm 26 i inmodule 18 i. This process may be reversed in whole or in part to movethe workpiece(s) in the opposite direction. Thus, in one aspect,workpieces may be moved in any direction along axis X and to anyposition along the transfer chamber and may be loaded to and unloadedfrom any desired module (processing or otherwise) communicating with thetransfer chamber. In other aspects, interstitial transfer chambermodules with static workpiece supports or shelves may not be providedbetween transfer chamber modules 18B, 18 i. In such aspects of thepresent disclosure, transport arms of adjoining transfer chamber modulesmay pass off workpieces directly (or through the use of a bufferstation) from end effector or one transport arm to end effector ofanother transport arm to move the workpiece through the transferchamber. The processing station modules may operate on the substratesthrough various deposition, etching, or other types of processes to formelectrical circuitry or other desired structure on the substrates. Theprocessing station modules are connected to the transfer chamber modulesto allow substrates to be passed from the transfer chamber to theprocessing stations and vice versa. A suitable example of a processingtool with similar general features to the processing apparatus depictedin FIG. 1C is described in U.S. patent application Ser. No. 11/442,511,previously incorporated by reference in its entirety.

Referring to FIGS. 1A and 2 (which is a perspective view of the loadport module 24 of the processing apparatus in accordance with thisexemplary aspects of the present disclosure), the load port module 24has a frame 29 that may generally define (as noted before) a transportcontainer holding or support area 28 and a closable port 30P throughwhich substrates are transported in and out of the mini-environmentinside the front section housing 16. The load port module 24 may besubstantially similar to that described in U.S. Pat. No. 8,821,099entitled “Load Port Module” and issued on Sep. 2, 2014, the disclosureof which is incorporated herein by reference in its entirety. Thehousing 16 and load port module 24 of the EFEM are connected, as will bedescribed further below, to form a chamber or space 25 that issubstantially closed from the exterior, and as noted before, provides acontrolled or mini-environment within the front section 12 (alsoreferred to as an EFEM). For example, the front section may include acontrolled air flow system (not shown), such as vents, louvers, laminarflow system, to avoid particulate contamination from entering themini-environment in the front section 12. As seen in FIGS. 1A and 2, thetransport container holding area 28 of the load port module 24 may havea primary or first station 36 and a secondary station 34. In thisaspect, each station 36, 34 of the holding area 28 may be capable ofholding a transport container T, though in alternate embodiments, thetransport container holding area may have more or fewer holdingstations, and each holding station may be capable of supporting anydesired number of substrate transport containers. The transportcontainer T (FIG. 1A) shown seated on the holding stations 36, 34 aredepicted for example purposes as being front opening uniform pods(FOUPs) style containers, though in alternate embodiments, the holdingstations of the load port holding area may be capable of supporting anydesired type of transport container such as SMIF containers.

In the aspect shown in FIG. 1A, the front section 12 has the load portmodules 24 located on the front face 12F of the front section 12 forexample purposes. In this location, the load port module 24 may bepositioned to facilitate placement and removal of transport containersT, onto at least one holding station 34, 36 of the load port moduleholding area 28, using any suitable automated material handling system(AMHS) (not shown). As seen in FIGS. 1A-2, the load port module holdingarea 28 projects forwards from the face 12F of the front section, andaccess for removal/placement, with the AMHS, of the transport containersT onto the holding area 28 may be from the top or front. In alternateembodiments, the load port module may be located on other sides of thefront section as desired. In still other alternate embodiments, the loadport modules may be located on two or more sides of the front section12. As seen in FIG. 2, the load port module 24 in this exemplary aspectmay have an extension zone 38 projecting outwards from the base plate ofthe load port module 24.

Referring again to FIGS. 1A-3, the transport container holding area 28,of the load port module 24 may have both an upper 36 and lower 34support station, each support station 36, 34 may be capable of holdingor supporting a transport container T as shown in FIG. 1A. In thisaspect, the lower station 34 is located generally under the upperstation 36. The lower station 34 may comprise opposing members 34L (onlyone of which is shown in FIG. 3) capable of conformally engagingstructure of the transport container T so that when placed in the lowerstation 34, the transport container is supported from members 34L. FIGS.6A-6B respectively are front and bottom perspective views of anexemplary substrate transport container T. The container T in FIGS.6A-6B is shown as having FOUP type configuration. In alternateembodiments, the substrate container may have any other desiredconfiguration as seen best in FIG. 6A, transport container T generallyhas a casing T2 and a casing cover or door T4 removably connected to thecasing. The casing T4 has an upper surface T6 with a fixture T8projecting therefrom. The fixture T8 may include lateral flanges oroutwardly projecting seating surfaces T10 that are offset a distancefrom the upper surface T6 of the casing. The seating surfaces T10 may bepart of a handling flange conforming to SEMI; E47.1-1001. The seatingsurfaces T10 may serve for engaging the coupling portion (not shown) ofa container transporter of an automated material handling system andthereby supporting the container from the transporter. Referring againto FIGS. 2-3, the support members 34L of the lower station 34 on theload port module holding area 28, are shown in this aspect as having anangle or general L shaped configuration. The members 34L have inwardprojecting flanges 34F as shown. In alternate embodiments, the supportmembers 34L may have any other suitable shape. The support members 34Lmay be for example metal, plastic, or any other suitable material, andmay be connected as shown in FIG. 3 to support structure 296 of the loadport frame 29. The inwardly pointing flanges 34F are sized to beadmitted between seating surface T10 (see FIG. 6A) on the transportcontainer and upper surface T6 of the container. The flanges 34F of theopposing members 34L are sufficiently separated to allow insertion ofsupport fixture T8 of the container T between the flanges with theoutward projecting seating surfaces T10 overhanging (at least partially)the corresponding flanges 34F. Accordingly, when loaded into the lowerstation 34, the transport container T is supported by seating surfacesT10 seated on the flanges 34F.

In this aspect, the transport container T may be manually positioned byan operator on the lower station 34, by inserting the container (in thedirection indicated by arrow I in FIG. 2) so that fixture T8 is moved inbetween flanges 34F. In alternate embodiments, the support members ofthe lower support station may have any other desired orientation toallow the transport container to be positioned from any other desireddirection. Removal of the transport container T from the lower station34 may be accomplished in a substantially reverse manner, with the usermanually withdrawing the container in the opposite direction frominstallation. The lower support station 34 provides the load port modulewith another container stowage location where the user may place atransport container T in the case when the upper support station 36 iseither occupied by another transport container or is in some state (suchas testing) preventing placement of the transport container T on theupper station. As noted before, in alternate embodiments, the load portmodule may not have a lower support station in the transport containerholding area 28.

Referring now again to FIG. 2, the upper support station 36 of thetransport container holding area 28 on load port module 24, generallycomprises a base support or shelf 50 and a carriage or shuttle 52movably mounted on the shelf 50. A shuttle drive system 54 operablyconnects the shuttle 52 to the shelf 50 and is capable of moving theshuttle 52 on the shelf 50. The drive system 54 moves the shuttle (inthe direction indicated by arrow M in FIG. 2) between a first positionand a second position. As will be described further below, the shuttle52 is configured to allow placement of a transport container T thereon.The first shuttle position may be disposed such that the transportcontainer T may be positioned automatically on (or picked off) thecarriage by the automated material handling system (not shown). Thesecond position to which shuttle 52 may be moved, is located so that thetransport container T on the shuttle may be docked to the door 30D (seeFIG. 1A) as will be described further below. When the shuttle is in thissecond position, the transport container T thereon is located in whatwill be referred to for convenience purposes as the docked location. Thecontroller 400 is communicably connected to sensors on the shuttle andthe drive system as will be described further below.

As seen in FIG. 1A, the transport container T is placed on the shuttle52 with the bottom surface of the container seated on the shuttle. Theshuttle 52 is hence configured, as will be described further below toconformally engage the bottom of the transport container T. FIG. 6B is abottom view illustrating features of the bottom T3 of the exemplarysubstrate transport container T. In this aspect, the bottom T3 of thetransport container has features generally conforming to specificationin SEMI E47.1. In alternate embodiments, the bottom of the substratetransport container may have any other desired features. In this casebottom T3 generally includes container sensing pads T12, one each of afront end of line (FEOL) and back end of line (BEOL) information padsT14, T16, a container capacity (i.e. number of substrate holdinglocations) information pad T18 and a box or cassette information padT20. The container bottom T3 may further include slots T22 forengagement by locating/kinematic coupling pins 66 on the shuttle 52. Afirst recess T24 into the bottom surface is provided as a firstretention feature. The bottom of the container also has a secondretention feature T26 formed therein. The second retention featuregenerally comprises a generally circular recess T30 formed into thebottom that has an outer aperture T32 with substantially squared offedges T34 (forming engagement lips T36).

FIGS. 4A-4D, are respectively a schematic perspective, a top plan, frontand side elevation views of the shuttle 52 and part of the support shelfstructure on which the shuttle sits (the support shelf structure 50 isvisible only in FIGS. 4C-4D). The shuttle 52 generally comprises achassis or frame 55 and a cover 56 positioned over the chassis. Theshuttle 52 may also generally have locating features 58 for helpinglocate the container T properly onto the shuttle, coupling features 60for positive coupling of the seated container T to the shuttle, anddetection system 62 for detecting the presence and accurate placement ofthe container T on the shuttle 52. Referring now also to FIG. 5, showinga partial cutaway view of the shuttle 52, chassis 55 may have anysuitable shape, and may be made from any suitable material, able tosupport the static and dynamic loads associated with placement andremoval of the transport container T on the shuttle as well as movementof the container and shuttle between the first and second positions. Thechassis 55 may have a motion system (not shown) such as rollers orslides allowing free movement of the shuttle 52 (in the directionindicated by arrow M in FIG. 2) relative to the support shelf 50 of theload port module frame. Support shelf 50, shown partially in FIG. 5,(see also FIG. 2) may be formed by support structure 296 of frame 29(see FIG. 3). The shelf 50 may include tracks or rails (not shown),formed on or depending from frame structure 296 (for example the topplate 296H or side plates 296E) on which the motion system of thechassis 55 rides. The container locating features 58, coupling features60, detection system 62 and cover 56 are mounted to the chassis 55.

As seen best in FIGS. 4A-4B, in this aspect container locating features58 on shuttle 52 may include a projecting engagement member 64. In thisaspect, the engagement member 64 may have a general frusto-pyramidalshape, generally conformal to the shape of locating recess T24 (see FIG.6B) in the bottom T3 of the container. The engagement member 64, may beanchored to the chassis 55, and project through a suitable opening inthe cover 56 sufficiently above the upper surface 56U of the cover toengage the locating recess T24 in the container when the container T isseated on the shuttle 52. The engagement member 64 may have cam surfaces64C for cooperating with the edges of the container locating feature inorder to aid proper automatic positioning of the container T onto theshuttle. In alternate embodiments, the shuttle may not have anengagement member like member 64. In this aspect, the shuttle 52 mayhave locating posts (also referred to as kinematic coupling pins) 66.Posts 66 may serve both as locating features aiding correct positioningof the container T on the shuttle 52, as well as to provide a means ofpositive coupling (i.e. Kinematic coupling) the container T to theshuttle 52. As may be realized from FIGS. 4B and 6B, the posts 66 arepositioned on the shuttle 52 to cooperate with slots T22 in thecontainer bottom T3. Posts 66, which may be formed from any suitablematerial, such as metal or plastic, may be anchored directly to thechassis 54 of the shuttle as shown in FIG. 5. The posts 66 may projectthrough (suitable holes in) the cover 56 to engage the bottom of thecontainer in slots T22 (see FIG. 6B). In this aspect, the posts 66 maydefine the supporting plane for the transport container T on theshuttle. The ends or tips 66T of the posts 66 may have a generallyconical or rounded shape as seen in FIGS. 4D and 5. This provides thedesired three contact points between the shuttle 52 and bottom of thecontainer for precise and repeatable definition of the support plane forthe container on the shuttle. As may be realized, posts 66 support theweight of the container T, and hence have a configuration, such asradial flanges shown in FIG. 5, to distribute the container weight tothe chassis. The conical tops 66T of the posts 66 may also operate ascaming surfaces against the inclined sides of slots T22 in the containerbottom mechanically guiding the container along the support plane untilthe desired position (effected by the geometry of the slots T22 and thetops 66T of posts 66) of the container on the shuttle is established.

The detection system 62 of the shuttle 52 generally comprises a numberof switches 68 distributed over the area of the shuttle. The switches 68may be located on the shuttle 52 to cooperate with the container sensingpads T12, the FEOL and BEOL info pads T14, T16, the container capacityand cassette information pads T18, T20 on the bottom of the container.FIG. 4B illustrates the positions of the pads T12-T20 on the bottom ofthe container T overlaid on the cover 56 and switches 68 of the shuttle52. In this aspect, the switches 68 are generally of the same type andsimilar to each other and will be described below with reference to arepresentative switch. In alternate embodiments, different kinds ofswitches may be used in different locations on the shuttle correspondingto the different types of information capable of being relayed to thegiven switch by the different information pads T16-T20 of the containerT. The architecture of representative switch 68 is seen best in FIG. 5.In this aspect, switch 68 may be an electro-optic switch generallycomprising a base or sensor portion 68O and an actuation portion 68I.Actuation portion 68I is spring loaded as will be described furtherbelow, and is actuated by contact with a corresponding pad on thecontainer bottom. The sensor portion 68O detects actuation of theactuation portion sending a signal to the control system. As seen inFIG. 5, sensor portion 68O may be mounted on a PCB 74 positioned on thechassis 55 of the shuttle. PCB 74 may have traces 68E formed therein forboth power and signal transmission. The traces 68E may be terminated tosuitable surface contacts (not shown) to which contact terminals ofelectronic components may be connected as desired (using any suitablemeans for mounting electronic components onto PCB's including flush wavesoldering). The contact terminals (both power and signal) of the sensorportion 68O may be connected to the traces 68E in the PCB 74 in asimilar manner. Mounting electronic components, such as the sensorportions 68O of the switches 68 to a PCB (such as PCB 74) with integraltraces, serves to eliminate the individual conductors, as well as theircostly and time consuming installation on the chassis, that wouldotherwise be used to connect the components to the power supply andcontrol system. The traces 68E in the PCB may extend to a terminalconnector (not shown) to which, for example, the connectorized end of aflexible wire harness 72 (see also FIG. 4D) may be mated. As may berealized the wire harness may link the traces 68E in the PCB 74, andhence the electronic components such as the sensor portions of thedetector switches 68 to the control system 400 (see FIG. 2) and powersupply (not shown). The sensor portion 68O may have for example asuitable light source such as an LED and a photo detector such as aphoto cell. In the unactivated state of the switch the light source may,for example, illuminate the photo cell which causes the sensor portion68O to send a signal (via traces 68E) to the control system 400 that isinterpreted by the control system as being the inactivated state of theswitch 68. Upon obstruction of the light source, such as by some portionof the actuation portion 68I of the switch, the signal from the photocell changes which in turn is read by the control system as the switchnow being in the actuated state. In alternate embodiments, the sensorportion 68O may be configured so the light source is obstructed when theswitch 68 is in the inactivated state, and illuminating the photodetector when in the activated state.

As seen in FIG. 5, the actuation portion 68I of the switch 68 isintegrated into the cover 56 of the shuttle 52. The spring biasing theactuation portion 68I is in this aspect formed by a portion of the cover56. The cover 56 of the shuttle 52 may be made for example of plastic,or sheet metal or any other suitable material. In this aspect, cover 56may be a one-piece member (i.e. of unitary construction). In the casethe cover 56 is plastic, it may be formed for example by injectionmolding or any other suitable process. As seen in FIGS. 4A-4D, the cover56 in this aspect may have a general hexahedron shape, with an uppersurface 56U and perimeter walls 56W projecting from the upper surface.In alternate embodiments, the shuttle cover may have any other suitableshape. As seen best in FIG. 2, when mounted on the chassis 55, the cover56 serves to substantially enclose the chassis within, with but a minorgap being provided between the bottom edge of the cover perimeter walls56W and shelf 50 to facilitate free relative movement of the shuttlewhile minimizing entry of dust or other particulates into the shuttlesystems. The top surface 56U of the cover has through holes 56H formedtherein as shown in FIG. 4A. Holes 56H allow posts 66 to extend throughthe cover 56 as seen best in FIG. 5. Holes 56H in this aspect also serveto position the cover 56 onto the shuttle chassis 55 as also shown inFIG. 5 (the clearance between the hole edge and corresponding post 66 issufficiently small, so that the post 66 provides accurate positioning ofthe cover 56 relative to chassis 55. Further, in this aspect the rims ofthe holes 56H are seated on collars 66C of the posts 66, as shown inFIG. 5, thereby supporting the cover 56 from the posts. In alternateembodiments, the cover may have any other desired mounting system forattaching the cover and chassis. As seen in FIGS. 4A-4B, the uppersurface 56U of the cover has a number of resiliently flexible tabs orfingers 70 formed therein. The tabs 70 may be formed by any suitablemeans such as cutting the top surface 56U of the cover 56. The number oftabs 70 may coincide with the number of switches 68 of detection system62. In this aspect, there are eight tabs 70 formed into the uppersurface of the cover. In alternate embodiments, the cover may have anyother desired number of flexible tabs formed therein. In other alternateembodiments, flexible tabs may be formed in any other desired surface ofthe cover. In the aspect shown in FIGS. 4A-4B, the tabs 70 aresubstantially similar to each other, and hence, tabs 70 may have similarresiliently flexible characteristics. In alternate embodiments, theshape (i.e. length, cross-section) of different tabs may vary to providethe different tabs with different flexibility characteristics. In thisaspect, the tips 70E of the tabs 70 are located on the cover so thatwhen the cover is mounted to the chassis each tip 70E is positionedsubstantially over the sensor portion 68O of the corresponding switch 68(see FIG. 5). In alternate embodiments, the tabs may be placed so thatany other desired portion of the tab (i.e. the tab mid-section) ispositioned over the sensor portion of the corresponding switch. The taborientation on the upper surface 56U of the cover may be otherwiseselected as desired to provide the tab with the flexibility of anunrestrained cantilever. The orientations of tabs 70 shown in FIGS.4A-4B are merely exemplary, and the tabs may have any other desiredorientation.

As seen best in FIG. 5, in this aspect the actuation portion 68I of theswitch 68 is mounted or located on the tip 70E of the corresponding tab70. The actuation portion 68I may be of unitary construction with thetab 70 (formed for example during the molding process of the cover uppersurface) or may be mounted to the tab 70 with suitable bonding meanssuch as adhesive. The actuation portion 68I68I projects sufficientlyfrom the upper surface 56U of the cover to come in contact with thecorresponding pads T12-T20 of the container placed on posts 66, and bythis contact generate sufficient deflection of the tab 70 to move theinterrupter flag portion 68F of the actuation portion to (e.g. obstructthe light source and) cause activation of the switch 68. When thecontainer T is removed from the shuttle 52, the flexible tab 70 resilesback to the undeflected position returning the switch to the inactivatedstate. As may be realized, if the container T is not properly placed onthe shuttle, there may be some misalignment between pads T12-T20 of thecontainer and at least some of the actuation portions 68I of theswitches 68 so that at least some of the switches do not activate. Thesignal combination of some switches activated and others not, may beinterpreted by the control system 400 as an indication of improperplacement of the container T on the shuttle. The control systemprogramming may then prevent motion of the shuttle 52 and commandcorrective action to correct placement or removal of the container fromthe shuttle.

As noted before, shuttle 52 may have a coupling feature 60 for positivecoupling of the transport container T to the shuttle. As also notedbefore, posts 66 serve as kinematic coupling means between the shuttleand container during shuttle motion. In this aspect, the shuttlecoupling feature 60 may also include a container clamping system 61substantially similar to that described in U.S. Pat. No. 8,821,099previously incorporated by reference herein in its entirety.

Referring now again to FIGS. 2 and 4A-4D, shuttle 52 may be moved (inthe direction indicated by arrow M in FIG. 2) between the first orloading position and the docked position of the shuttle by drive system54. As seen best in FIGS. 4C-4D, the shuttle drive system 54 in thisaspect generally comprises an electric motor 53 driving a lead screw 57.In alternate embodiments, the shuttle may have any suitable type ofdrive system such as a pneumatic or hydraulic drive system. The electricmotor 53 in this aspect may be any suitable type of motor such as anA.C. or D.C. motor, a stepper motor or servo motor. Motor 53 may befixedly mounted to the shelf structure 50. The lead screw 57 isconnected to the output shaft of the motor. The motor may be capable ofrotating the lead screw both clockwise and counterclockwise. The leadscrew 57 is also drivingly engaged to the chassis 55 of the shuttle 52which rides along linear bearing(s) 283 (FIG. 3). Engagement between thelead screw and chassis may be provided by any suitable means such as forexample a threaded bushing fixed to the chassis and threadably engagedby the lead screw. Rotation of the lead screw 57 by motor 53 results inaxial motion of the bushing over the lead screw, and hence of thechassis and shuttle 52 relative to the shelf 50 to which the motor 53 isfixed. As seen in FIG. 4C the motor 53 is communicably connected to thecontroller 400 by a suitable circuit 91. The controller 400 may provideboth command signals and power (from a suitable power supply) to motor53 over circuit 91. The motor 54 may include a motor encoder 58E (seeFIG. 4D) for sending position indication data to the controller. Thecontroller 400 may be capable of processing the motor encoder data toidentify the position of the shuttle on the load port. In alternateembodiments, a linear encoder may be mounted between the shuttle andsupport shelf to identify the shuttle position during movement. As seenin FIG. 4C, in this aspect circuit 91 may also include a pinchprotection circuit 90 capable of detecting an obstruction to shuttlemotion. The pinch protection circuit may include a current sensor 92, ofany suitable type, and of desired sensitivity capable of measuringcurrent changes to motor 53. The current sensor 92 is configured asdesired to monitor the current supplied to motor 53 through circuit 91.Measurement signals from the sensor 92 are transmitted by circuit 90 tothe controller 400. The pinch protection circuit 90 may be a closed loopor open loop system as desired. As may be realized, when the shuttle isbeing advanced by the drive motor 53 and encounters an obstruction, thecurrent supplied the motor (via circuit 91) increases in generalproportion to the level of resistance to shuttle motion provided by theobstruction. The “excess” current is detected by sensor 92 and theinformation is relayed to the controller 400 via circuit 90. The sensor92 may be capable of sending raw or unprocessed sensor data to thecontroller 400. The controller may be programmed (such as a suitablealgorithm) to process the data from the sensor to identify, from noise,when excess current, of sufficient level and of sufficient duration toindicate an obstruction, is being supplied to the motor 53. Controller400 has an auto-reverse program 402 (see FIG. 1A) wherein uponidentification of the excess current (and hence of the obstruction toshuttle motion) the controller sends a command signal to motor 53stopping the previously commanded operation and reversing the motordirection. The rotation of the lead screw 57 effecting movement of theshuttle 52 is thus also reversed thereby causing the movement of theshuttle to be reversed away from the obstruction. The shuttle may bereversed a predetermined distance established from encoder 53Einformation. In alternate embodiments, the current sensor 92 may beprogrammable to select desired set points for detecting the excesscurrent. In this case, the current sensor may send a suitable signal tothe control upon detection of an excess current having a level andduration exceeding the programmed set points. Upon receiving the signalfrom the current sensor, the controller accesses the auto-reverseprogram 402 in the controller memory. This provides superior obstructiondetection and recovery system at a lower cost than conventional systemsthat employ a deflectable (i.e. pinch) bar.

Referring now again to FIG. 2, the load port module in the aspect shownmay have transport container advance detection system 110 (depictedschematically in FIG. 2). The container advance detection system 110 isa non-contact system to detect a feature of a container T mounted to andbeing advanced by the shuttle 52 and effect stopping the shuttle so thatwhen the container is in the docked position the front face of thecontainer is in a desired repeatable location regardless of thetolerance variations between different containers. It is desirable tostop the load port shuttle advance motion so that there is a minimumclearance between the container and the load port frame 29 withoutactual contact between them. Since container dimensions will vary,especially between manufactures, in conventional systems the shuttlemovement is generally adjusted for “worst case”, allowing an overlylarge clearance in most instances. The container advance detectionsystem 110 of the load port module 24 overcomes the problems ofconventional systems allowing different containers to be stopped withthe front face at location L1 providing minimum clearance. The detectionsystem 110 in this aspect has a “thru beam” sensor configuration with anemitter or source of radiating energy and a detector for detecting theradiating energy from the emitter. For example, in this aspect thedetection system 110 may have a light source 112, such as a LED or laserdiode on the terminal end of an optical fiber connected to a suitableremote light source. The system 110 may also have a suitable lightsensing portion 114 such as a photo cell for sensing the light beam fromthe source 112. As seen in FIG. 2 the light source 112 and sensor 114are positioned on opposite sides of the shuttle 52 and at a desiredheight so that the container T mounted and transported by the shuttle 52will break the light beam B emitted by the source 112 and illuminatingat least the sensing part of sensor 114. Though not shown in FIG. 2, thelight source 112 and sensor 114 may be housed in suitable covers forcontact and particulate protection and to prevent inadvertentinterruption of the beam by objects other than the container transportedby shuttle 52. As seen in FIG. 2, the sensors 112, 114 are positioned atan offset distance in the direction of shuttle travel (indicated byarrow M in FIG. 2) so that the light beam B is spaced a desired distanced from the location L1 of the front face of the container T when broughtto the docked position by the shuttle. As may be realized, the frontface of the container T advanced by the shuttle, breaks the beam B whenat distance d from the docked position location L1. The controller 400is programmed with distance d. The controller 400 is also programmedwith an algorithm (program module 401 in FIG. 1A) that uses shuttlemovement information, such as may be provided to the controller by motorencoder 53E (see also FIG. 4D), and the distance d to determine whenshuttle advance movement is to be stopped so that the front face of thecontainer T on the shuttle is at location L1. Hence, when the front faceof the advancing container T breaks beam B, the sensor 114 sends asuitable signal to the controller 400 informing the controller of thedetection of the container front face. The controller 400 then maydetermine when to command the shuttle advance to stop as noted above,and sends the command to the shuttle drive section 54 at the correcttime. In this manner, each container T transported by the shuttle isappropriately positioned in its docked location to have the containerfront face at location L1 regardless of the dimensional variationbetween containers.

With the container T in the docked position, as shown in FIG. 1A, thedoor T4 of the container may be engaged by the door 30D of the load portmodule access port 30P. The door T4 in the front face of the container Tis schematically illustrated in FIG. 6A. The door T4 may include latchsystems T40, T42 that when engaged retain the door T4 in the containerbox. Examples of the latch systems for the container door are disclosedin U.S. Pat. No. 5,772,386, issued Jun. 30, 1998 and incorporated byreference herein in its entirety. The door latch systems T40, T42 mayinclude a pivotable hub T44, to which the latch tabs T46 may bearticulately linked. Rotation of the hub T44 causes actuation of thelatch tabs T46 to engage and disengage the container housing. The latchhub T44 is accessible through latch key access holes T50 in the door T4.The container door T4 may also have locator pin holes T52 as shown inFIG. 6A. Referring again to FIG. 2, the access port door 30D of the loadport module has locator pins 120 and latch keys 122 in a complementaryor matching configuration to the locator pin holes T52 and latch keyaccess holes T50 in the door T4 of the container. The locator pins 120and latch keys 122 in port door 30D may be similar to locator pins andlatch keys in U.S. Pat. No. 5,772,386 (previously incorporated byreferenced herein). The latch keys 122 of the port door 30D conform tothe shape of the key access holes T50 in the container door and key holein the hub T44 of the latching system. When the port door 30D engagesthe container door T4, the latch keys 122 on the access door 30D enterthrough key access holes T50 into the key holes formed in the hub T44 ofthe container. Rotation of the latch keys 122 causes rotation of thehubs T44 and actuation of the latch systems to engage/disengage thelatch tabs thereby locking or unlocking the container door T4 from thecontainer. The latch keys 122 are rotatably mounted in the access doorstructure and are operated in a manner substantially similar to thatdescribed in U.S. Pat. No. 8,821,099, the disclosure of which waspreviously incorporated herein by reference in its entirety.

Referring now to FIGS. 7A and 7B, there is shown schematic elevationviews of a substrate processing apparatus or tool 1002 and container(s)T connected thereto in accordance with another exemplary embodiment. Theprocessing apparatus 1002, in the exemplary embodiment shown in FIG. 7A,is generally similar to the substrate processing tools illustrated inFIGS. 1A, 1B, and 1C. The process tool 1002 may generally have a processsection 1006 and EFEM 1004 (continuing, for explanation purposes only,with the reference convention in which wafers may be considered to beloaded into the tool from the front). In the exemplary embodiment, theprocess section 1006 and EFEM 1004 may share a common controlledenvironment or atmosphere (e.g. inert gas (N2), (Ar), or very clean dryair). The process section 1006, is shown schematically, and may includeone or more process sections or module(s) connected to the EFEM 1004(the arrangement shown in FIG. 7A is merely exemplary and the EFEM andprocess section module(s) may be connected to each other in any desiredarrangement in alternate embodiments). The process section(s) ormodule(s) 1006 may be capable of being isolated from the EFEM 1004, suchas with a closable opening (e.g. a gate valve). Accordingly, the processsection may also be provided with a different process atmosphere thanthe EFEM atmosphere. In alternate embodiments, the process section 1006may include a load lock allowing process modules with dissimilaratmospheres or holding a vacuum to be connected to the EFEM as will bedescribed further below.

The EFEM 1004 in the exemplary embodiment shown in FIG. 7A, may besimilar to those described above except as otherwise noted. The EFEM1004 may include suitable environmental controls to maintain a desiredcontrolled environment or atmosphere in the EFEM when substrate aretransported to and from the process section 1006. For example, the EFEM1004 may include a controller 31000 (which may be substantially similarto controller 400 described above), one or more fluid control valves31010, 31020, a pressure relief or check valve 31030 and sensors, suchas for example, pressure sensor 31040, contamination sensor 31041 andtemperature sensor 31042. The controller may be configured to adjust orregulate attributes such as the temperature pressure and rate of gasflow 31050 of the controlled environment within the EFEM (and processsection 1006). For example, the controller 31000 may receive signalsfrom the pressure sensor 31040, temperature sensor 31042 andenvironmental contamination sensor 31041. Depending on the environmentalinformation in those signals the controller may release or increasepressure within the EFEM, increase or reduce air flow 31050 within theEFEM by actuating the appropriate valves 31010, 31030. The controller31000 may also be configured to increase or decrease the temperature ofthe gas within the EFEM (e.g. via adjusting coolant flow throughradiator 31060) based on temperature readings provided by temperaturesensor 31042. As may be realized, while the controller 31000 andassociated valves and sensors are described with respect to FIGS. 7A and7B, the controller 31000 may be used to control the environment(s) ofthe other embodiments disclosed herein.

The EFEM 1004 may include a substrate transport apparatus or robot 1004R(the robot, as may be realized, may be of any desired type) capable ofholding and transporting substrates. Similar to that described above,the EFEM 1004 may include the load port 24 (as described herein) forinterfacing one or more container(s) T to the tool 1002, and allowingsubstrates to be loaded and unloaded to and from the tool 1002. The loadport 24, of the EFEM 1004, and a corresponding complementing interfaceportion of the container(s) T (as described herein), may be configuredto enable loading and unloading of substrates between container and EFEMwithout degradation of the controlled environment in the EFEM 1004 andprocess section 1006. The EFEM load port 24, and complementing interfaceportion of the container T, which may be collectively referred to as thecontainer To EFEM interface, may be arranged so that container(s) Tinterfaced to the EFEM, are integrated into the tool. By way of example,the container(s) T so integrated via the load port 24, may define achamber(s) sharing the same controlled atmosphere as the EFEM, and thuscapable of holding substrates in the same controlled atmosphere as theEFEM, so that substrates may be transported directly from container T toprocess section or process module by the EFEM transport robot 1004R.Similar to the aspects of the present disclosure described before, thecontainer to EFEM interface in the exemplary embodiment shown in FIG.7A, defines what may be referred to before as a clean tunnel (withsubstantially the same cleanliness as throughout the EFEM and processsection) from within the container chamber, through the interface intothe EFEM, and throughout the process section. The clean tunnel may beclosed (such as when the container(s) is removed from the load port),and opened freely without degradation to the clean tunnel. In the aspectshown in FIG. 7A, the container to EFEM interface may also be arrangedto enable direct integration of the container T with the tool(substantially as described above) independent of container environmentprior to interface, in a manner substantially similar to that describedin U.S. Pat. No. 9,105,673 entitled “Side Opening Unified Pod” andissued on Aug. 11, 2015, the disclosure of which is incorporated hereinby reference in its entirety. Thus, in the aspect illustrated in FIG.7A, the container(s) T may be interfaced with and integrated directly toprocess tools having different or dissimilar environments (e.g. cleanair to inert gas environment, or clean air to vacuum) and then transportdirectly between tools with different dissimilar environment andinterfaced and integrated again with the tools as will be describedfurther below. Accordingly, a substrate(s) at one tool with a controlledenvironment may be transferred directly with the EFEM robot 1004R, fromthe process section (similar to process section 1006) through the cleantunnel into the container(s) T, the container(s) T transported directlyand interfaced to the EFEM (similar to EFEM 1004) of another toolpossibly with a dissimilar/different controlled environment, and thesubstrate(s) transferred directly with the EFEM robot through the cleantunnel now defined in the other tool to the process section withoutdegradation of the controlled environment in the other process tool. Ineffect, the container to EFEM interface in combination with thecontainer may be considered to define an exterior load lock, orcontainer load lock.

Referring still to FIG. 7A, in the aspect illustrated in FIG. 7A, theload port 24 is shown interfacing with one container T for examplepurposes, though in alternate embodiments, the load port may be arrangedto interface with any desired number of containers. For example, inalternate aspects, the load port may have a generally stackedconfiguration capable of interfacing a number of containers arrayed in astack similar to that described in U.S. Pat. No. 9,105,673, thedisclosure of which has been previously incorporated by reference hereinin its entirety. In accordance with the present disclosure, the loadport 24 may have a vacuum source 1010V capable of being communicablyconnected to the container(s) T held on the load port in order to pumpdown the container, for example to clean molecular contaminants from thecontainer interior and substrates therein when the container is on theload port. Conversely, the container may be arranged in any suitablemanner to communicably interface with the vacuum source 1010V at theload port and to withstand atmospheric pressure in the containercasement when the container is pumped down to vacuum, such as describedin U.S. Pat. No. 9,105,673.

The container T may have suitable passages and orifice(s) or ports 776(which may be vacuum ports, purge gas ports, or the ports may be commonto both vacuum and purge gas sources) so that, on connection or couplingthe container with the load port 24, the vacuum source 1010V of the loadport is automatically coupled to the container housing and communicateswith the container interior. As described herein, coupling of thecontainer T to the vacuum source 1010V and/or actuation of the vacuumsource 1010V when coupled to the container T may cause corrosive gasegress 910, 920, 930 (FIG. 9) from the container T, such as at thecoupling and/or through a door seal of the container T. The location ofthe ports 776 shown in FIG. 7A is merely exemplary, and in alternateembodiments the vacuum port may be positioned as desired. As may berealized, container seals (see, e.g., door seal 940 in FIG. 9) havedesired integrity to withstand vacuum across the seal.

As seen in FIG. 7A, in the exemplary embodiment illustrated, thecontainer T may also be configured to be communicably connected to a gasfeed, such as a source of vent or purge gas. In the exemplary embodimentshown in FIG. 7A, the container T may be communicably connected to gassource/feed 1010G, when seated on the container support of the load port24. As may be realized, the container T may have a suitable inlet port776 (plug (and suitable gas channels connecting the container interior)to couple (for example automatically) to a nozzle of the gas feed 1010G,such as when the container is placed on the load port support surfaces.As described herein, coupling of the container T to the gas source 1010Gand/or actuation of the gas source 1010G when coupled to the container Tmay cause corrosive gas egress 910, 920, 930 (FIG. 9) from the containerT, such as at the coupling and/or through a door seal of the containerT. The arrangement of the gas source interface between load port andcontainer shown in FIG. 7A is merely exemplary and in alternateembodiments the gas source interface between container and load port mayhave any other desired location and configuration. As noted before, thegas source 1010G may be capable of providing for example purge and/orvent gas to the container seated on or located at the load port 24. Byway of example, with the container T suitably positioned (such as froman overhead transport) at load port 24, and the gas feed nozzleconnected to the container to feed gas into the container housing, apurge gas (e.g. N2) may be fed into the container if desired (dependingon the interior atmosphere of the container when positioned at the loadport, and the environment being maintained in the EFEM). Thus, if thecontainer for example contains some process atmosphere, (such as from aninterface with a previous tool), and the EFEM 1004 may be maintainedwith an inert gas or very clean air atmosphere, that may be dissimilarfrom the container atmosphere, upon positioning the container at theload port, desired purge gas may be fed into the container such as viagas feed 1010G, purging the container atmosphere so that the containermay be interfaced with the load port opening and integrated to the tool1002 is previously described. Moreover, in the event that containeratmosphere is considered incompatible with or possibly presentingundesired contaminants to, the EFEM environment, upon positioning thecontainer at the load port (but for example before opening the containerinterior to the EFEM environment), the container interior may be pumpedto sufficient vacuum via vacuum source 1010V, and filled with the inertgas (e.g. N2, very clean air) similar to the environment in the EFEM toclean the potential contaminants from the container T, and allowingintegration of the container T to the tool as previously described. Asmay be realized, one or more of the ports 776 may be coupled to thevacuum source 1010V and one or more other ports 776 may be coupled tothe purge gas source 1010G to effect purging of the container T.

As noted above, the purge gas feed 1010G may, in addition to or in lieuthe vacuum source 1010V, operate the actuator 5000 in a mannersubstantially similar to that described above. Information regarding thecontainer atmosphere may be recorded on a RFID (radio frequencyidentification) tag, or other suitable data storage device, capable ofbeing read (or otherwise accessed) by a suitable reader at or proximateto the load port 24 with which the container is being loaded.Accordingly, suitable information regarding the container interior maybe obtained by the tool controller, reviewed with a desired protocol andif desired the container may be pumped and vented as previouslydescribed when positioned at the load port 24. Information regarding thecontainer atmosphere for example may be recorded on the container bornestorage device when the container is docked to the load port, or anyother suitable time. Such information may also be tracked by a FAB widecontroller if desired. As may be realized, the container T may also beinterfaced with a EFEM that may not have vacuum and gas feedconnections. In alternate embodiments, the container may include aninternal or onboard source of purge gas, such as described in U.S. Pat.No. 9,105,673, to effect purging the container when positioned at a loadport. As may be realized, in other aspects, the load port interfaceinterfacing with the container may be provided with a vacuum connection,and no gas feed, that gas being provided for example from a gas sourceon board the container. Thus, as may be realized the container may nowserve as a substrate cleaning chamber of the tool, storing substrates atthe tool so they are undergoing cleaning. As may be realized, thecontainer pump/vent may also be performed prior to removal of thecontainer T from the load port 24 such as when repositioning thecontainer T to another tool.

As noted before, the arrangement of the load port and container to toolinterface shown in FIG. 7A is merely exemplary, and in other aspects,the interface may have any other desired configuration. For example, thegas feed may be positioned as desired to vent gas from EFEM environmentinto the container after the container interior has been pumped.

Referring to FIGS. 9-11, as described above, placement of the containerT on the load port 24 (or removal of the container T from the load port24) may cause corrosive gas egress 910, 920 from the container T at, forexample, the purge/vent port couplings 10000-10005, where the purge/ventport couplings 10000-10005 are substantially coupled to the ports 776(e.g., predetermined access locations, also noting that the containerdoor 30D to container T interface 983 may also be considered apredetermined access location) on the container T. Corrosive gas egress930 may also occur at/from a door seal 940 (FIG. 9) such as where thedoor seal 940 is worn or the interior of the container T is overpressurized. There may be a slit or small opening 999 between, forexample, the shuttle 52 and the shelf 50 that may allow fluidic accessto, e.g., printed circuit boards (PCBs) 74 (FIG. 5), linear bearing(s)283 (FIG. 3), motors (see e.g., motor 53 (FIG. 4D), sensors (see sensorsT12-T20 (FIG. 4B), sensor 68O (FIG. 5), switches 68 (FIG. 5), sensor 92(FIG. 4C)), wire harness(es) 72 (FIG. 4D), detection system(s) 110 (FIG.2), and/or other suitable components of the load port 24. In accordancewith aspects of the present disclosure, and as described herein, atleast one continuous steady state differential pressure plenum region960-963 (also referred to as continuous steady state fluid mass flowplenum region(s)) may substantially prevent corrosive gas egress throughthe slit 999 and substantially prevent corrosive gas contact with, forexample, the suitable components of the load port 24 including, but notlimited to, printed circuit boards (PCBs) 74 (FIG. 5), linear bearing(s)283 (FIG. 3), motors (see e.g., motor 53 (FIG. 4D), sensors (see sensorsT12-T20 (FIG. 4B), sensor 68O (FIG. 5), switches 68 (FIG. 5), sensor 92(FIG. 4C)), wire harness(es) 72 (FIG. 4D), detection system(s) 110 (FIG.2), and/or other suitable components of the load port 24 that are inproximity of the container T disposed on the load port 24. As also notedabove, the at least one continuous steady state differential pressureplenum region 960-963 may alleviate costs, modifications, manufacturingcomplexity, and manufacturing lead time associated with coatings beingapplied to the load port components. In one aspect, the controller 400is configured to control a fluid mass flow of the continuous steadystate differential pressure plenum region 960-963 depending on aconfiguration of a container T held by the load port 24. For example,the controller 400 may adjust the fluid mass flow in any suitable mannerto enlarge or reduce an area covered by the continuous steady statedifferential pressure plenum region 960-963 (e.g., change a location ofthe fluid flow boundaries) so that the area covered encompasses a purgeport 601-604 (FIG. 6B) configuration of the carrier T coupled to theload port 24 (e.g., where the purge port configuration may change fromcontainer to container and/or from container manufacturer to containermanufacturer).

As described above, the load port module 24 includes the frame 29 thatis adapted to connect the load port module 24 to the substrateprocessing apparatus (such as those described above. The transportcontainer holding area 28 connected to the frame 29 for holding at leastone substrate cassette container T proximate the access port/transportopening 30P of the load port module 24. The transport container holdingarea 28 is configured so that a sealed internal atmosphere 977 of the atleast one substrate cassette container T is accessed from the transportcontainer holding area 28 at predetermined access locations (e.g., suchthe ports 776) of the at least one substrate cassette container T. Thetransport container holding area 28 has a predetermined continuoussteady state differential pressure plenum region(s) (see differentpressure plenum regions 960, 961, 962, 963, 966, 967 in FIGS. 9, 10A,and 10B, and continuous steady state differential pressure plenum region963 in FIGS. 9, 10B, and 11) disposed on the transport container holdingarea 28 that are located exterior to the EFEM and outside the load portopening 30P (e.g., exterior to the BOLTS interface between the load portmodule 24 and the EFEM 12.

The predetermined continuous steady state differential pressure plenumregion(s) is/are determined at least in part by boundaries 960B, 961B,962B, 963B, 964, 965, 966B, 967B of fluid flow generating differentialpressure, so that the predetermined continuous steady state differentialpressure plenum region(s) defines a continuous steady state fluidic flowisolation barrier 968 (also referred to as a continuous steady stateisolation barrier of fluid flow) disposed on the transport containerholding area 28 between the predetermined access locations (e.g., ports776) of the at least one substrate cassette container T and anotherpredetermined section (e.g., such as the sections/portions of the loadport module 24 that may be susceptible to corrosion) of the transportcontainer holding area 28 isolating the other predetermined section fromthe predetermined access locations. In one aspect, the continuous steadystate fluidic flow isolation barrier 968 of the continuous steady statedifferential pressure plenum region(s) is generated to provide apredetermined offset from the other predetermined section of thecassette support (such as support 36) or load port 24 isolated by thecontinuous steady state fluidic flow isolation barrier 968, and thepredetermined offset is set by the fluid flow generating thedifferential pressure of the continuous steady state differentialpressure plenum region(s). For example, referring also to FIG. 10B, thecontinuous steady state fluidic flow isolation barrier 968 includescontinuous steady state differential plenum regions 962, 967 havingrespective boundaries 967B, 962B. The other predetermined section of thecassette support or shuttle 52 in this example, may be the aperture10099 for the coupling features 60 that positively couple the containerT to the shuttle. Motors, printed circuit boards, etc. that are to beprotected from corrosive gases may be disposed beneath and accessiblethrough the aperture 10099. The fluid mass flow of the respectivecontinuous steady state differential plenum regions 962, 967 may becontrolled so that the barriers 967B, 962B are offset by a distance10098 from the aperture 10099 to substantially prevent corrosive gasegress into the aperture 10099. In one aspect, fluid edges (e.g., suchas boundaries 960B, 961B, 962B, 963B, 964, 965, 966B, 967B) of the fluidflow of the continuous steady state fluidic flow isolation barrier 968seal the other predetermined section from the predetermined accesslocations. In one aspect, the fluid edges of the fluid flow of thecontinuous steady state fluidic flow isolation barrier seal the otherpredetermined section from escapement of venting gas (e.g., thecorrosive gas egress_910, 920, 930) from the sealed internal atmosphereof the at least one substrate cassette container T at the predeterminedaccess locations.

Referring to FIGS. 9-11, in accordance with the aspects of the presentdisclosure, the load port module 24 includes one or more plenum ports10010-10016 configured to generate or otherwise create the fluid flowthat at least in part defines the boundaries 960B, 961B, 962B, 963B,964, 965, 966B, 967B of the predetermined continuous steady statedifferential pressure plenum region(s). The one or more plenum ports10010-10016 are separate and distinct from the container T vacuum purgeports 10000-10005 of the load port module 24. While the one or moreplenum ports 10010-10016 are illustrated as substantially circularapertures or substantially rectangular apertures, in other aspects theone or more plenum ports may be elongated slits that circumscribe or areotherwise disposed adjacent predetermined features (such as thosedescribed herein) of the load port 24 so as to create fluidic walls thateffect the boundaries 960B, 961B, 962B, 963B, 964, 965, 966B, 967Bdescribed herein. The one on or more plenum ports 10010-10016 arepositioned proximate predetermined sections/regions of the load portmodule 24 exterior that is adjacent to a load port module 24 feature(e.g., such as those described above) having predeterminedcharacteristics that make the feature susceptible to corrosion (e.g.,from the corrosive gas egress) so as to substantially prevent thecorrosive gas egress from interfacing or otherwise contacting the loadport module 24 feature. In other aspects, referring also to FIGS. 12 and13) one or more plenum ports 10017, 10018 (substantially similar toplenum ports 10010-10016) may be disposed between the shuttle 52 and thesupport 50 so that one or more continuous steady state differentialpressure plenum region(s) 970, 971 (substantially similar to the othercontinuous steady state differential pressure plenum region(s) describedherein) are disposed at least partially between the shuttle 52 and thesupport 50 so that boundaries 970B, 971B of the continuous steady statedifferential pressure plenum region(s) 970, 971 substantially preventcorrosive gas egress to any suitable components (e.g., motors, printedcircuit boards, etc. as described herein). In still other aspects, theplenum ports may be disposed at any suitable positions of the load portto create any suitable number of continuous steady state differentialpressure plenum region(s) to substantially protect load port componentsfrom corrosive gas egress with a corresponding continuous steady statefluidic flow isolation barrier. Depending on whether the one on or moreplenum ports 10010-10018 are positive pressure ports or negative (e.g.,vacuum) pressure ports, the one or more plenum ports 10010-10018 may bedisposed above or below the load port feature around which thecontinuous steady state differential pressure plenum region(s) is to beprovided.

The one or more plenum ports 10010-10018 are configured to create one ormore of the boundaries 960B, 961B, 962B, 963B, 966B, 967B, 970B, 971Bwhile other boundaries 964, 965 may be created by the structure of theload port 24 (such as a surface 52S (FIG. 10A) of the shuttle 52) and/orthe substrate cassette container T, where the continuous steady statedifferential pressure plenum region(s) is bounded at least on one sideby a surface of the cassette support structure of the load port 24defining the continuous steady state differential pressure plenumregion(s) at least on part. In one aspect, the surface 52S may guide thefluid flow generating the differential pressure of the continuous steadystate differential pressure plenum region(s). In one aspect, the surface52S may include vanes 52V (FIG. 10A) or other fluid flow controlfeatures that guide the fluid flow generating the differential pressureof the continuous steady state differential pressure plenum region(s).In one aspect, each plenum port 10010-10018 is configured to generate arespective predetermined continuous steady state differential pressureplenum region that circumscribes or otherwise surrounds the respectiveplenum port 10010-10018 and an at least a portion of an associatedpredetermined access location (e.g., respective vacuum/purge ports10000-10005 and container/door interface 983).

As can be seen in FIGS. 9 and 10A (noting the container T is notillustrated in FIG. 10A for clarity), the plenum ports 10010, 10013 areconfigured to generate respective predetermined differential pressureplenums 966, 961 having respective boundaries 966B, 961B. The plenumports 10002, 10012 are configured to generate respective predetermineddifferential pressure plenums 967, 962 having respective boundaries967B, 962B. As may be realized, the bottom surface of the container Tand the exterior surface of the shuttle 52 may also form boundaries 964,965 of the respective differential pressure plenums 966, 961, 967, 962.The differential pressure plenums may substantially contain corrosivegas egress from an associated vacuum/purge port 776 of the container Tsubstantially coupled to a respective vacuum/purge port 10000-10005 ofthe load port module 24).

As can be seen in FIGS. 9, 10B, and 11, one or more of the plenum ports10014-10018 is/are configured to generate respective differentialpressure plenum 963 having respective boundary 963B. As may be realizedat least a portion of the boundary 963B may be formed by the exteriorsurface of the shuttle 52 and or the container T. The differentialpressure plenum may be sized to substantially contain corrosive gasegress from one or more of the container/door interface 983 and a loadport door 30D to load port frame 29 interface 276 (see FIG. 2). Thedifferential pressure plenum port 10014 may be disposed on the load portmodule 24 shelf 50 while the differential pressure plenum ports 10015,10016 may be disposed on a side of the shuttle 52 facing the load portopening 30P so that the differential pressure plenum 963 extends fromthe load port door 30D to load port frame 29 interface 276 to thecontainer/door interface 983; while in other aspects, the differentialpressure plenum ports 10015, 10016 on the shuttle 52 and thedifferential pressure plenum port 10014 on the shelf 50 may provide forseparate and distinct differential pressure plenums (e.g., when theshuttle 52 is disposed at a container T load position) where theseparate and distinct differential pressure plenums merge when theshuttle is disposed at a container T docking position (e.g., where thecontainer substrate passage opening, through which substrates enter andexit the container, is mated with the load port opening 30P). In thisaspect, at least some of the differential pressure plenum ports may bestationary with respect to the shuttle 52 reference frame (e.g., thedifferential pressure plenum ports are mounted to the shuttle) whileother differential pressure plenum ports are stationary or fixedrelative to the load port module 24 frame 29 (e.g., where the shuttleand/or a part to be protected from corrosive gases moves relative to theframe 29).

In one aspect, a size of the respective differential pressure plenums966, 961, 967, 962, 963, 970, 971 may be increased or decreased byadjusting a mass flow rate of fluid moving into (e.g., a vacuum/suctionpressure plenum) or out of (e.g., a positive pressure plenum) therespective plenum ports 10010-10018. Referring to FIG. 9, a size of therespective differential pressure plenums 966, 961, 967, 962, 963 may besuch that one or more of the respective differential pressure plenumsmerge with another of the differential pressure plenums. For example, asillustrated in FIG. 9, the differential pressure plenums 961, 966, 962,967 may merge to form combined differential pressure plenum 960 thatextends over substantially an entirety of the container T bottom. Instill other aspects, differential pressure plenum 963 may also be mergedwith differential pressure plenum 960 so that the differential pressureplenum also extends to cover the container door 30D/container Tinterface 983 (and/or the load port door/frame interface 276—FIG. 2). Inother aspects the sizes of the differential pressure plenums 966, 961,967, 962, 963 may be sized so that any suitable number of thedifferential pressure plenums are merged into a common differentialpressure plenum.

Still referring to FIGS. 9-11, as described above, the continuous steadystate fluidic flow isolation barrier 968 formed by the predeterminedcontinuous steady state differential pressure plenum region(s) 960, 961,962, 963, 966, 967 may be a positive pressure continuous steady statefluidic flow isolation barrier. For example, the differential pressureΔP (see in FIG. 9) is a positive pressure relative to atmosphere (e.g.,an external area surrounding the container T and load port module 24).In another aspect, the differential pressure ΔP is a positive pressurerelative to a pressure (e.g., partial pressure) of escapement gas (e.g.,the corrosive gas egress 910, 920, 930) from the sealed internalatmosphere of the at least one substrate cassette container T at thepredetermined access locations (e.g., ports 776). Referring also to FIG.13, where the continuous steady state fluidic flow isolation barrier 968formed by the predetermined continuous steady state differentialpressure plenum region(s) 960, 961, 962, 963, 966, 967 is the positivepressure continuous steady state fluidic flow isolation barrier, cleandry air from any suitable clean dry air source 13000 is provided to oneor more of the differential pressure plenum ports 10010-10018 in anysuitable manner (e.g., such as through suitable conduits 13010). Anysuitable pressure sensors may be provided on the load port module 24 tomonitor the clean dry air emitted from the one or more of thedifferential pressure plenum ports 10010-10018. The clean dry air may beprovided substantially continuously (e.g., at container docking with theshuttle 52, at coupling of the container T to the load port opening 30P,at decoupling of the container from the load port opening 30P, and atundocking of the container T from the shuttle 52) so that the positivepressure continuous steady state fluidic flow isolation barriersubstantially prevents corrosive gases from at least the container Tfrom entering the areas of the load port module 24 around which thecontinuous steady state fluidic flow isolation barrier(s) 968 isprovided.

Still referring to FIGS. 9-11, as described above, the continuous steadystate fluidic flow isolation barrier 968 formed by the predeterminedcontinuous steady state differential pressure plenum region(s) 960, 961,962, 963, 966, 967 may be a negative pressure continuous steady statefluidic flow isolation barrier. For example, the differential pressureΔP (see in FIG. 9) is a negative pressure relative to atmosphere (e.g.,the external area surrounding the container T and load port module 24).In another aspect, the differential pressure ΔP is a negative pressurerelative to pressure (e.g., a partial pressure) of an escapement gas(e.g., the corrosive gas egress 910, 920, 930) from the sealed internalatmosphere of the at least one substrate cassette container T at thepredetermined access locations (e.g., ports 776). The negative pressurecontinuous steady state fluidic flow isolation barrier may be employedin conjunction with or in lieu of the positive pressure continuoussteady state fluidic flow isolation barrier. Similarly, the positivepressure continuous steady state fluidic flow isolation barrier may beemployed without the negative pressure continuous steady state fluidicflow isolation barrier.

In one aspect, referring also to FIG. 12, where the continuous steadystate fluidic flow isolation barrier 968 formed by the predeterminedcontinuous steady state differential pressure plenum region(s) 960, 961,962, 963, 966, 967 is the negative pressure continuous steady statefluidic flow isolation barrier, vacuum/suction from any suitable remote(e.g., located away from the load port shuttle 52 and shuttle support50) vacuum/suction source 12000 (e.g., such as a pump, fan, vacuum,etc.) is provided to one or more of the differential pressure plenumports 10010-10016 in any suitable manner (e.g., such as through suitableconduits 12010). In another aspect, referring also to FIG. 13, where thecontinuous steady state fluidic flow isolation barrier 968 formed by thepredetermined continuous steady state differential pressure plenumregion(s) 960, 961, 962, 963, 966, 967 is the negative pressurecontinuous steady state fluidic flow isolation barrier, vacuum/suctionfrom any suitable local (e.g., disposed on the shuttle 52 and/or shuttlesupport 50) vacuum/suction source 12001 (e.g., such as a pump (e.g.,acoustic air pump, piezo pump, diaphragm pump, etc.), fan, etc.) isprovided to one or more of the differential pressure plenum ports10010-10018 in any suitable manner (e.g., such as through suitableconduits 12010). While the local vacuum/suction source 12001 isillustrated as being coupled to the shuttle 52 so as to move with theshuttle 52; it should be understood that the vacuum/suction source 12001may be coupled to the shuttle support 50 in a similar manner (such asto, e.g., provide suction to the differential pressure plenum port10014) so as to be stationary with the shuttle support 50. The suctionedcorrosive gases evacuated by the negative pressure predeterminedcontinuous steady state differential pressure plenum region(s) 960, 961,962, 963, 966, 967 may be discharged away from the load port module 24at any suitable location. Where the vacuum/suction source 12001 is localto the shuttle 52 and/or shuttle support 50 any suitable fluid directingpaths 13012 (e.g., channels, hoses, vanes, passages, etc.) may be formedin or pass through the shuttle 52 and/or shuttle support tooutput/exhaust any corrosive gas egress 910, 920, 930 that may escapefrom the sealed environment of the container T.

Referring to FIGS. 7A, 8A, 9, and 10A, an exemplary docking processbetween the container T and the load port 24 will be described. Forexample, the container T is transported to the load port 24 (FIG. 8A,Block 800) and is optionally clamped to the load port (FIG. 8A, Block805), such as with the container clamping system 61 described above. Atarrival of the container T the predetermined continuous steady statedifferential pressure plenum region(s) 960, 961, 962, 963, 966, 967 areactive so that the continuous steady state fluidic flow isolationbarrier 968 is formed upon coupling the container T to the shuttle 52.In this aspect, the vacuum purge ports 10000-10005 of the load port 24may be automatically coupled with the ports 776 of the container T. Asdescribed above, coupling of the container T to the gas source 1010Gand/or vacuum source 1010V (and/or actuation of the same when coupled tothe container T) may cause corrosive gas egress 910, 920, 930 (see FIG.9) from the container T, such as at the couplings between the ports10000-10005 with the ports 776, and/or through a door seal 940 of thecontainer T. The corrosive gas egress 910, 920, 930 may be substantiallycontained/confined and/or evacuated with the differential pressureplenum space or region on (or active). For example, as described above,the continuous steady state fluidic flow isolation barrier 968 maysubstantially contain (e.g., in the case of a vacuum barrier) orsubstantially prevent ingress (in the case of a positive pressurebarrier) of any corrosive gas egress 910, 920, 930 from the sealedenvironment of the container T that occurs, upon coupling of the ports10000-10005 with the ports 776, to the areas of the load port (such asthose noted above) protected from the corrosive gas by the fluidicisolation barrier 968.

The load port 24 shuttle 52 advances the container T to thecontainer/load port interface 750, where the container/load portinterface 750 is a BOLTS interface (FIG. 8A, Block 810). Prior to orduring advancement of the container T to the container/load portinterface 750 the container T may be vented and/or purged as describedabove. In one aspect, the load port door may also include a vacuum thatmay be activated during advancement of the container T so that anyparticulate matter on the surface of the container T may be removedduring the interfacing of the container T and load port 24.

The load port 24 shuttle 52 presses the container T against thecontainer/load port interface 276 (FIG. 2) to couple the container T tothe load port 24 (FIG. 8A, Block 815). The container door T4 (FIG. 6A)is clamped to the load port door 30D, as described herein, (FIG. 8A,Block 820). The predetermined continuous steady state differentialpressure plenum region(s) 960, 961, 962, 963, 966, 967 may remain activeso that the continuous steady state fluidic flow isolation barrier 968exists in an area at least partially occupied or otherwise locatedbeneath by the container door T4 to port door 30D interface. Thecontainer door T4 starts to retract (FIG. 8A, Block 835). As thecontainer door T4 starts to retract the seal between the container T andthe container door T4 may be relaxed and corrosive gas from inside thecontainer T may escape from the container. The predetermined continuoussteady state differential pressure plenum region(s) 960, 961, 962, 963,966, 967 (such as differential plenum region 963) may substantiallycontain (e.g., in the case of a vacuum barrier) or substantially preventingress (in the case of a positive pressure barrier) of any corrosivegas egress 910, 920, 930 from the sealed environment of the container Tthat occurs upon retraction of the container door T4 from the containerT. The container door T4 separates from the container T (FIG. 8A, Block845) and is lowered into the door storage area 770 (FIG. 7A) of the loadport 24 (FIG. 8A, Block 850). In alternate aspects, the container T maybe registered/docked to the load port 24 in any suitable manner.

Referring to FIGS. 7A, 8B, 9, and 10A, an exemplary undocking processbetween the container T and the load port 24 will be described. Thecontainer door T4 is raised from the door storage area 770 (FIG. 8B,Block 855) and is advanced towards the container T (FIG. 8A, Block 860).The container door T4 starts to seal with the container (FIG. 8B, Block865) and further advancement of the container door T4 seals thecontainer door T4 with the container T (FIG. 8B, Block 870). As thecontainer door starts to seal and seals with the container T gases fromthe interior of the container T may be displaced out of the containereither through the door seal 940 (FIG. 9) and/or through the interfacebetween the ports 776 of the container T and the ports 10000-10005 ofthe load port 24. The predetermined continuous steady state differentialpressure plenum region(s) 960, 961, 962, 963, 966, 967 may substantiallycontain (e.g., in the case of a vacuum barrier) or substantially preventingress (in the case of a positive pressure barrier) of any corrosivegas egress 910, 920, 930 from the container T that occurs upon sealingof the container door T4 with the container T.

The container door T4 is unclamped, from e.g., the load port door 30D,(FIG. 8B, Block 875) and the container T is released from the containerto load port opening interface 276 (FIG. 2). The container T retreatsfrom the interface 276 through movement of the shuttle 52 (FIG. 8A,Block 885). In some aspects the container T is unclamped from theshuttle 85 of the load port 24 (FIG. 8B, Block 890). The container Tdeparts from the load port 24 (FIG. 8B, Block 985) in any suitablemanner, such as through automated handling devices or manually.Decoupling of the container T from the gas source 1010G and/or vacuumsource 1010V may cause corrosive gas egress 910, 920, 930 (see FIG. 9)from the container T, such as at the couplings between the ports10000-10005. The corrosive gas egress 910, 920, 930 may be substantiallycontained/confined and/or evacuated with the differential pressureplenum space or region on (or active). For example, as described above,the continuous steady state fluidic flow isolation barrier 968 maysubstantially contain (e.g., in the case of a vacuum barrier) orsubstantially prevent ingress (in the case of a positive pressurebarrier) of any corrosive gas egress 910, 920, 930 from the sealedenvironment of the container T that occurs, upon decoupling of the ports10000-10005 from the ports 776, to the areas of the load port (such asthose noted above) protected from the corrosive gas by the fluidicisolation barrier 968. In alternate aspects, the container T may beunregistered/undocked from the load port 24 in any suitable manner.

Referring to FIGS. 7A, 8B, 9, 10A, and 14 an exemplary method 1400 willbe described. The method 1400 includes providing a frame 29 of asubstrate loading device (FIG. 14, Block 1401). The frame 29 beingadapted to connect the substrate loading device to a substrateprocessing apparatus 10, the frame 29 having a transport opening 30Pthrough which substrates are transported between the substrate loadingdevice and processing apparatus 10. A cassette support 28 is provided(FIG. 14, Block 1402) and is connected to the frame 29 for holding atleast one substrate cassette container T proximate the transport opening30P, the cassette support 28 being configured so that a sealed internalatmosphere 977 of the at least one substrate cassette container T isaccessed from the cassette support 28 at predetermined access locations776 of the at least one substrate cassette container T. The method alsoincludes defining, with a predetermined continuous steady statedifferential pressure plenum region 960-963, a continuously steady statefluidic flow isolation barrier 968 disposed on the cassette support 28(FIG. 14, Block 1403) between the predetermined access locations 776 ofthe at least one substrate cassette container T and anotherpredetermined section of the cassette support 28 isolating the otherpredetermined section from the predetermined access locations 776, wherethe cassette support 28 has the predetermined continuous steady statedifferential pressure plenum region 960-963 disposed on the cassettesupport 28 and the predetermined continuous steady state differentialpressure plenum region 960-963 is determined at least in part byboundaries 960B, 961B, 962B, 963B, 964, 965, 966B, 967B of fluid flowgenerating differential pressure.

Referring to FIGS. 7A, 8B, 9, 10A, and 15 an exemplary method 1500 willbe described. The method 1500 includes providing a frame 29 of asubstrate loading device (FIG. 15, Block 1501) adapted to connect thedevice to a substrate processing apparatus 10, the frame 29 having atransport opening 30P through which substrates are transported betweenthe device and processing apparatus. A cassette support 28 is provided(FIG. 15, Block 1502) and is connected to the frame 29 for holding atleast one substrate cassette container T proximate the transport opening30P, the support 28 being configured so that a sealed internalatmosphere 977 of the container T is accessed from the support 28 atpredetermined access locations 776 of the container T. The method alsoincludes defining, with a continuous steady state fluid mass flow plenumregion, a continuous steady state isolation barrier 968 of fluid flowdisposed on the support 28 (FIG. 15, Block 1503) between thepredetermined access locations 776 of the container T and anotherpredetermined section of the cassette support 28 isolating the otherpredetermined section from the predetermined access locations 776, wherethe cassette support 28 has the predetermined continuous steady statefluid mass flow plenum region disposed on the support 28 and thepredetermined continuous steady state fluid mass flow plenum region isdetermined at least in part by boundaries 960B, 961B, 962B, 963B, 964,965, 966B, 967B of fluid mass flow.

In accordance with one or more aspects of the present disclosure asubstrate loading device is provided. The substrate loading devicecomprises: a frame adapted to connect the substrate loading device to asubstrate processing apparatus, the frame having a transport openingthrough which substrates are transported between the substrate loadingdevice and processing apparatus; a cassette support connected to theframe for holding at least one substrate cassette container proximatethe transport opening, the cassette support being configured so that asealed internal atmosphere of the at least one substrate cassettecontainer is accessed from the cassette support at predetermined accesslocations of the at least one substrate cassette container; and thecassette support has a predetermined continuous steady statedifferential pressure plenum region disposed on the cassette support,determined at least in part by boundaries of fluid flow generatingdifferential pressure, so that the predetermined continuous steady statedifferential pressure plenum region defines a continuous steady statefluidic flow isolation barrier disposed on the container support betweenthe predetermined access locations of the at least one substratecassette container and another predetermined section of the cassettesupport isolating the other predetermined section from the predeterminedaccess locations.

In accordance with one or more aspects of the present disclosure fluidedges of the fluid flow of the continuous steady state fluidic flowisolation barrier seal the other predetermined section from thepredetermined access locations.

In accordance with one or more aspects of the present disclosure fluidedges of the fluid flow of the continuous steady state fluidic flowisolation barrier seal the other predetermined section from escapementof venting gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to a pressure ofescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a negative pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a negative pressure relative to pressure of anescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thepredetermined continuous steady state differential pressure plenumregion is bounded at least on one side by a surface of the cassettesupport defining the predetermined continuous steady state differentialpressure plenum region at least in part.

In accordance with one or more aspects of the present disclosure thesurface is a guide surface for the fluid flow generating thedifferential pressure of the predetermined continuous steady statedifferential pressure plenum region.

In accordance with one or more aspects of the present disclosure thecontinuously steady state fluidic flow isolation barrier of thecontinuous steady state differential pressure plenum region is generatedto provide a predetermined offset from the other predetermined sectionof the cassette support isolated by the continuously steady statefluidic flow isolation barrier, and the predetermined offset is set bythe fluid flow generating the differential pressure of the continuoussteady state differential pressure plenum region.

In accordance with one or more aspects of the present disclosure, thesubstrate loading device includes a controller that controls thepredetermined continuous steady state differential pressure plenumregion depending on a configuration of the at least one substratecassette container.

In accordance with one or more aspects of the present disclosure asubstrate loading device includes a frame adapted to connect the deviceto a substrate processing apparatus, the frame having a transportopening through which substrates are transported between the device andprocessing apparatus; a cassette support connected to the frame forholding at least one substrate cassette container proximate thetransport opening, the support being configured so that a sealedinternal atmosphere of the container is accessed from the support atpredetermined access locations of the container; and the cassettesupport has a predetermined continuous steady state fluid mass flowplenum region disposed on the support, determined at least in part byboundaries of fluid mass flow, so that the continuous steady state fluidmass flow plenum region defines a continuous steady state isolationbarrier of fluid flow disposed on the support between the predeterminedaccess locations of the container and another predetermined section ofthe cassette support isolating the other predetermined section from thepredetermined access locations.

In accordance with one or more aspects of the present disclosure fluidedges of the fluid flow of the continuous steady state isolation barrierof fluid flow seal the other predetermined section from thepredetermined access locations.

In accordance with one or more aspects of the present disclosure fluidedges of the fluid flow of the continuous steady state isolation barrierof fluid flow seal the other predetermined section from escapement ofventing gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a positive pressure relative to a pressure ofescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a negative pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a negative pressure relative to pressure of anescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thepredetermined continuous steady state fluid mass flow plenum region isbounded at least on one side by a surface of the cassette supportdefining the predetermined continuous steady state fluid mass flowplenum region at least in part.

In accordance with one or more aspects of the present disclosure thesurface is a guide surface for the fluid mass flow of the predeterminedcontinuous steady state fluid mass flow plenum region.

In accordance with one or more aspects of the present disclosure thecontinuously steady state isolation barrier of fluid flow of thecontinuous steady state fluid mass flow plenum region is generated toprovide a predetermined offset from the other predetermined section ofthe cassette support isolated by the continuously steady state isolationbarrier of fluid flow, and the predetermined offset is set by the fluidmass flow of the continuous steady state fluid mass flow plenum region.

In accordance with one or more aspects of the present disclosure, thesubstrate loading device includes a controller that controls thepredetermined continuous steady state differential pressure plenumregion depending on a configuration of the at least one substratecassette container.

In accordance with one or more aspects of the present disclosure amethod is provided. The method including providing a frame of asubstrate loading device, the frame being adapted to connect thesubstrate loading device to a substrate processing apparatus, the framehaving a transport opening through which substrates are transportedbetween the substrate loading device and processing apparatus, providinga cassette support connected to the frame for holding at least onesubstrate cassette container proximate the transport opening, thecassette support being configured so that a sealed internal atmosphereof the at least one substrate cassette container is accessed from thecassette support at predetermined access locations of the at least onesubstrate cassette container, and defining, with a predeterminedcontinuous steady state differential pressure plenum region, acontinuously steady state fluidic flow isolation barrier disposed on thecarrier support between the predetermined access locations of the atleast one substrate cassette container and another predetermined sectionof the cassette support isolating the other predetermined section fromthe predetermined access locations, where the cassette support has thepredetermined continuous steady state differential pressure plenumregion disposed on the cassette support and the predetermined continuoussteady state differential pressure plenum region is determined at leastin part by boundaries of fluid flow generating differential pressure.

In accordance with one or more aspects of the present disclosure furtherincluding sealing, with fluid edges of the fluid flow of the continuoussteady state fluidic flow isolation barrier, the other predeterminedsection from the predetermined access locations.

In accordance with one or more aspects of the present disclosure furtherincluding sealing, with fluid edges of the fluid flow of the continuoussteady state fluidic flow isolation barrier, the other predeterminedsection from escapement of venting gas from the sealed internalatmosphere of the at least one substrate cassette container at thepredetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to a pressure ofescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a negative pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a negative pressure relative to pressure of anescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thepredetermined continuous steady state differential pressure plenumregion is bounded at least on one side by a surface of the cassettesupport defining the predetermined continuous steady state differentialpressure plenum region at least in part.

In accordance with one or more aspects of the present disclosure thesurface is a guide surface for the fluid flow generating thedifferential pressure of the predetermined continuous steady statedifferential pressure plenum region.

In accordance with one or more aspects of the present disclosure thecontinuously steady state fluidic flow isolation barrier of thecontinuous steady state differential pressure plenum region is generatedto provide a predetermined offset from the other predetermined sectionof the cassette support isolated by the continuously steady statefluidic flow isolation barrier, and the predetermined offset is set bythe fluid flow generating the differential pressure of the continuoussteady state differential pressure plenum region.

In accordance with one or more aspects of the present disclosure furtherincluding controlling, with a controller, the predetermined continuoussteady state differential pressure plenum region depending on aconfiguration of the at least one substrate cassette container.

In accordance with one or more aspects of the present disclosure amethod is provided. The method including providing a frame of asubstrate loading device adapted to connect the device to a substrateprocessing apparatus, the frame having a transport opening through whichsubstrates are transported between the device and processing apparatus,providing a cassette support connected to the frame for holding at leastone substrate cassette container proximate the transport opening, thesupport being configured so that a sealed internal atmosphere of thecontainer is accessed from the support at predetermined access locationsof the container, and defining, with a continuous steady state fluidmass flow plenum region, a continuous steady state isolation barrier offluid flow disposed on the support between the predetermined accesslocations of the container and another predetermined section of thecassette support isolating the other predetermined section from thepredetermined access locations, where the cassette support has thepredetermined continuous steady state fluid mass flow plenum regiondisposed on the support and the predetermined continuous steady statefluid mass flow plenum region is determined at least in part byboundaries of fluid mass flow.

In accordance with one or more aspects of the present disclosure furtherincluding sealing, with fluid edges of the fluid flow of the continuoussteady state isolation barrier of fluid flow, the other predeterminedsection from the predetermined access locations.

In accordance with one or more aspects of the present disclosure furtherincluding sealing, with fluid edges of the fluid flow of the continuoussteady state isolation barrier of fluid flow, the other predeterminedsection from escapement of venting gas from the sealed internalatmosphere of the at least one substrate cassette container at thepredetermined access locations.

In accordance with one or more aspects of the present disclosure thedifferential pressure is a positive pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a positive pressure relative to a pressure ofescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a negative pressure relative to atmosphere.

In accordance with one or more aspects of the present disclosure thefluid mass flow has a negative pressure relative to pressure of anescapement gas from the sealed internal atmosphere of the at least onesubstrate cassette container at the predetermined access locations.

In accordance with one or more aspects of the present disclosure thepredetermined continuous steady state fluid mass flow plenum region isbounded at least on one side by a surface of the cassette supportdefining the predetermined continuous steady state fluid mass flowplenum region at least in part.

In accordance with one or more aspects of the present disclosure thesurface is a guide surface for the fluid mass flow of the predeterminedcontinuous steady state fluid mass flow plenum region.

In accordance with one or more aspects of the present disclosure thecontinuously steady state isolation barrier of fluid flow of thecontinuous steady state fluid mass flow plenum region is generated toprovide a predetermined offset from the other predetermined section ofthe cassette support isolated by the continuously steady state isolationbarrier of fluid flow, and the predetermined offset is set by the fluidmass flow of the continuous steady state fluid mass flow plenum region.

In accordance with one or more aspects of the present disclosure furtherincluding controlling, with a controller, the predetermined continuoussteady state differential pressure plenum region depending on aconfiguration of the at least one substrate cassette container.

It should be understood that the foregoing description is onlyillustrative of the aspects of the present disclosure. Variousalternatives and modifications can be devised by those skilled in theart without departing from the aspects of the present disclosure.Accordingly, the aspects of the present disclosure are intended toembrace all such alternatives, modifications and variances that fallwithin the scope of any claims appended hereto. Further, the mere factthat different features are recited in mutually different dependent orindependent claims, that may be appended hereto, does not indicate thata combination of these features cannot be advantageously used, such acombination remaining within the scope of the aspects of the presentdisclosure.

What is claimed is:
 1. A substrate loading device comprising: a frameadapted to connect the substrate loading device to a substrateprocessing apparatus, the frame having a transport opening through whichsubstrates are transported between the substrate loading device andprocessing apparatus; a cassette support connected to the frame forholding at least one substrate cassette container proximate thetransport opening, the cassette support being configured so that anisolated internal atmosphere of the at least one substrate cassettecontainer is accessed from the cassette support at predetermined accesslocations of the at least one substrate cassette container; and thecassette support has a predetermined continuous steady statedifferential fluid pressure plenum region disposed on the cassettesupport so that the predetermined continuous steady state differentialfluid pressure plenum region defines a continuously steady state fluidicisolation barrier disposed on the carrier support between thepredetermined access locations of the at least one substrate cassettecontainer and another predetermined section of the cassette supportisolating the other predetermined section from the predetermined accesslocations.
 2. The substrate loading device of claim 1, wherein thepredetermined continuous steady state differential fluid pressure plenumregion has a positive pressure relative to atmosphere.
 3. The substrateloading device of claim 1, wherein predetermined continuous steady statedifferential fluid pressure plenum region has a positive pressurerelative to a pressure of escapement gas from the isolated internalatmosphere of the at least one substrate cassette container at thepredetermined access locations.
 4. The substrate loading device of claim1, wherein the predetermined continuous steady state differential fluidpressure plenum region has a negative pressure relative to atmosphere.5. The substrate loading device of claim 1, wherein the predeterminedcontinuous steady state differential fluid pressure plenum region has anegative pressure relative to pressure of an escapement gas from theisolated internal atmosphere of the at least one substrate cassettecontainer at the predetermined access locations.
 6. The substrateloading device of claim 1, wherein the predetermined continuous steadystate differential fluid pressure plenum region is bounded at least onone side by a surface of the cassette support defining the predeterminedcontinuous steady state differential fluid pressure plenum region atleast in part.
 7. The substrate loading device of claim 6, wherein thesurface is a guide surface for the fluid flow generating thedifferential fluid pressure of the predetermined continuous steady statedifferential fluid pressure plenum region.
 8. The substrate loadingdevice of claim 1, wherein the continuously steady state fluidicisolation barrier of the continuous steady state differential fluidpressure plenum region is generated to provide a predetermined offsetfrom the other predetermined section of the cassette support isolated bythe continuously steady state fluidic isolation barrier, and thepredetermined offset is set by the fluid flow generating thedifferential fluid pressure of the continuous steady state differentialfluid pressure plenum region.
 9. The substrate loading device of claim1, wherein the substrate loading device includes a controller thatcontrols the predetermined continuous steady state differential fluidpressure plenum region depending on a configuration of the at least onesubstrate cassette container.
 10. A substrate loading device comprising:a frame adapted to connect the device to a substrate processingapparatus, the frame having a transport opening through which substratesare transported between the device and processing apparatus; a cassettesupport connected to the frame for holding at least one substratecassette container proximate the transport opening, the support beingconfigured so that an isolated internal atmosphere of the container isaccessed from the support at predetermined access locations of thecontainer; and the cassette support has a predetermined continuoussteady state fluid mass flow plenum region disposed on the support sothat the continuous steady state fluid mass flow plenum region defines acontinuous steady state isolation barrier of fluid flow disposed on thesupport between the predetermined access locations of the container andanother predetermined section of the cassette support isolating theother predetermined section from the predetermined access locations. 11.The substrate loading device of claim 10, wherein the predeterminedcontinuous steady state fluid mass flow plenum region has one of: apositive pressure relative to atmosphere, a positive pressure relativeto a pressure of escapement gas from the isolated internal atmosphere ofthe at least one substrate cassette container at the predeterminedaccess locations, a negative pressure relative to atmosphere, or anegative pressure relative to pressure of an escapement gas from theisolated internal atmosphere of the at least one substrate cassettecontainer at the predetermined access locations.
 12. The substrateloading device of claim 10, wherein the predetermined continuous steadystate fluid mass flow plenum region is bounded at least on one side by asurface of the cassette support defining the predetermined continuoussteady state fluid mass flow plenum region at least in part.
 13. Thesubstrate loading device of claim 12, wherein the surface is a guidesurface for the fluid mass flow of the predetermined continuous steadystate fluid mass flow plenum region.
 14. The substrate loading device ofclaim 10, wherein the continuously steady state isolation barrier offluid flow of the continuous steady state fluid mass flow plenum regionis generated to provide a predetermined offset from the otherpredetermined section of the cassette support isolated by thecontinuously steady state isolation barrier of fluid flow, and thepredetermined offset is set by the fluid mass flow of the continuoussteady state fluid mass flow plenum region.
 15. The substrate loadingdevice of claim 10, wherein the substrate loading device includes acontroller that controls the predetermined continuous steady statedifferential fluid pressure plenum region depending on a configurationof the at least one substrate cassette container.
 16. A methodcomprising: providing a frame of a substrate loading device, the framebeing adapted to connect the substrate loading device to a substrateprocessing apparatus, the frame having a transport opening through whichsubstrates are transported between the substrate loading device andprocessing apparatus; providing a cassette support connected to theframe for holding at least one substrate cassette container proximatethe transport opening, the cassette support being configured so that anisolated internal atmosphere of the at least one substrate cassettecontainer is accessed from the cassette support at predetermined accesslocations of the at least one substrate cassette container; anddefining, with a predetermined continuous steady state differentialfluid pressure plenum region, a continuously steady state fluidicisolation barrier disposed on the carrier support between thepredetermined access locations of the at least one substrate cassettecontainer and another predetermined section of the cassette supportisolating the other predetermined section from the predetermined accesslocations.
 17. The method of claim 16, wherein the predeterminedcontinuous steady state differential fluid pressure plenum region hasone of: a positive pressure relative to atmosphere, a positive pressurerelative to a pressure of escapement gas from the isolated internalatmosphere of the at least one substrate cassette container at thepredetermined access locations, a negative pressure relative toatmosphere, or a negative pressure relative to pressure of an escapementgas from the isolated internal atmosphere of the at least one substratecassette container at the predetermined access locations.
 18. The methodof claim 16, wherein the predetermined continuous steady statedifferential fluid pressure plenum region is bounded at least on oneside by a surface of the cassette support defining the predeterminedcontinuous steady state differential fluid pressure plenum region atleast in part.
 19. The method of claim 16, wherein the continuouslysteady state fluidic isolation barrier of the continuous steady statedifferential fluid pressure plenum region is generated to provide apredetermined offset from the other predetermined section of thecassette support isolated by the continuously steady state fluidicisolation barrier, and the predetermined offset is set by the fluid flowgenerating the differential fluid pressure of the continuous steadystate differential fluid pressure plenum region.
 20. The method of claim16, further comprising controlling, with a controller, the predeterminedcontinuous steady state differential fluid pressure plenum regiondepending on a configuration of the at least one substrate cassettecontainer.